发明名称 |
ZUSAMMENSETZUNGEN AUS ALKOXYSILAN UND ORGANISCHEM POLYMER ZUR HERSTELLUNG VON DÜNNEN ISOLIERENDEN SCHICHTEN UND DEREN VERWENDUNG |
摘要 |
Disclosed is an alkoxysilane/organic polymer composition for use in producing an insulating thin film, comprising (A) a specific alkoxysilane; (B) a specific organic polymer; and (C) a solvent for alkoxysilane (A) and organic polymer (B), wherein solvent (C) comprises at least one organic solvent selected from the group consisting of amide linkage-containing organic solvents and ester linkage-containing organic solvents. Also disclosed are a silica-organic polymer composits thin film which is produced by a process comprising: forming a thin film of the composition of the present invention; subjecting the thin film to a hydrolysis and dehydration-condensation reaction with respect to the alkoxysilane thereof, to thereby cause the alkoxysilane to be gelled in the thin film; and removing the solvent remaining in the thin film by drying, and a porous silica thin film which is obtained by removing the organic polymer from the silica-organic polymer composite thin film. Both of the silica-organic polymer composite thin film and the porous silica thin film have advantages not only in that these thin films have a low dielectric constant suitable for insulating layers for a multilevel interconnect for a semiconductor device, but also in that these thin films can be produced by a method which can be easily performed in the current process for producing a semiconductor device. |
申请公布号 |
AT280806(T) |
申请公布日期 |
2004.11.15 |
申请号 |
AT19980932538T |
申请日期 |
1998.07.15 |
申请人 |
ASAHI KASEI KABUSHIKI KAISHA |
发明人 |
IOKA, TAKAAKI;TANABE, TSUNEAKI |
分类号 |
C08L83/04;B32B27/00;C08J5/18;C08K5/10;C09D183/02;C09D183/12;C09D183/14;H01L21/312;H01L21/316;H01L21/768;H05K1/00 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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