SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of easily packaging semiconductor devices of different types at a low cost and manufacturing method thereof.SOLUTION: A semiconductor chip 50 is mounted on a first plane F1-10 of a metal part 10 which has a first plane F1-10 and a second plane F2-10 located at the opposite side of the first plane, and is electrically connected to the metal part 10 (chip mounting part). A terminal part 80 has: a third face F3-80 which comes into contact with the second plane F2-10 of the metal part 10; a fourth face F4-80 located at the opposite side of the third face F3-80; and side faces F80S between the third face F3-80 and the fourth face F4-80. A resin 70 is formed on the second plane F2-10 of the metal part 10 and the side faces F80S of the terminal part 80.SELECTED DRAWING: Figure 3