| 摘要 |
PROBLEM TO BE SOLVED: To provide a fingerprint sensor apparatus wherein the wire bonding of a semiconductor chip which extracts a fingerprint and a bonding pad on a substrate is enabled easily, and a method for manufacturing the apparatus. SOLUTION: The fingerprint sensor apparatus is provided with the substrate 10, the bonding pad 11 formed on the substrate 10, a first semiconductor chip 16 wherein the opposite surface of a circuit forming surface is fixed on one main surface of the substrate 10, a second semiconductor chip 19 wherein the opposite surface of a circuit forming surface is fixed on the first semiconductor chip 16, a first bonding wire 22 which electrically connects a first electrode 17 and the bonding pad 11, a second bonding wire 23 which electrically connects the first electrode 17 and a second electrode 20, and sealing resin 24 in which an aperture 24a is formed from which a fingerprint sensor 21 is exposed. When viewing from above, the substrate 10 is greater by an amount W which is an attaching margin to an apparatus to be mounted than that of the sealing resin 24. COPYRIGHT: (C)2005,JPO&NCIPI
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