发明名称 INJECTION MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an injection molding method which can hold the temperature of the surface of a cavity brought into contact with a resin during the injection of the resin to be higher and is excellent in mass production properties. SOLUTION: After the surface of the cavity is heated by filling the cavity 11 of an injection mold 1 with overheated steam, the resin is injected/packed in the cavity 11 while the overheated steam is discharged outside the cavity 11. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004314494(A) 申请公布日期 2004.11.11
申请号 JP20030113080 申请日期 2003.04.17
申请人 SEKISUI CHEM CO LTD 发明人 SAWA HISASHI
分类号 B29C45/73;(IPC1-7):B29C45/73 主分类号 B29C45/73
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