发明名称 |
Sensor substrate and method of fabricating same |
摘要 |
A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.
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申请公布号 |
US2004223875(A1) |
申请公布日期 |
2004.11.11 |
申请号 |
US20040861976 |
申请日期 |
2004.06.04 |
申请人 |
MEDTRONIC MINIMED, INC. |
发明人 |
PENDO SHAUN;SHAH RAJIV;CHERNOFF EDWARD |
分类号 |
A61B5/00;H05K1/03;H05K3/28;H05K3/40;(IPC1-7):G01N21/00 |
主分类号 |
A61B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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