发明名称 |
Method for bonding an integrated circuit device to a glass substrate |
摘要 |
A method for bonding an integrated circuit device to a glass substrate is provided. The method comprises the following steps. First, a melting device is provided, and the melting device melts a predetermined portion of the glass substrate. Then, the integrated circuit device is bonded to the glass substrate without suffering from damages by sharp edges of the glass substrate.
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申请公布号 |
US2004221951(A1) |
申请公布日期 |
2004.11.11 |
申请号 |
US20040798235 |
申请日期 |
2004.03.10 |
申请人 |
CHUANG TA-KO;TANAKA SAKAE |
发明人 |
CHUANG TA-KO;TANAKA SAKAE |
分类号 |
H05K1/03;H05K3/00;H05K3/32;H05K3/36;(IPC1-7):B32B31/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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