Method and apparatus for wet etching using hot etchant

摘要

Provided are exemplary methods and equipment for wet etching processes that utilize etchant solutions at elevated temperatures, particularly for wet etch processes incorporated in the production of semiconductor devices. According to the exemplary methods, the semiconductor wafers to be etched are preheated using one or more of a variety of methods and apparatus prior to immersion in the hot etchant solution. This preheating of the semiconductor wafers reduces or eliminates temperature variation in etchant solution resulting from the insertion of the semiconductor wafers thereby improving the consistency and repeatability of the etch process.