| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dry film photoresist which can form a tent film having high resolution and hardly torn. <P>SOLUTION: In the dry film photoresist 11 consisting of a flexible transparent film supporting body 12 and a photosensitive resin composition layer 13 formed on the supporting body, the photosensitive resin composition layer 14 consists of a composition containing: (A) a binder component; (B) a monomer component containing a polymerizable compound having a urea bond and an ethylenically unsaturated bond; and (C) a photopolymerization initiator. The dry film photoresist 11 is excellent in developing property with a weak alkaline aqueous solution and stripping property with a strong alkaline solution, has high resolution by forming the resist into a thin layer, and has excellent tent strength over a through hole even in a thin film. Therefore, the photoresist can be used for the manufacture of a high-density printed wiring board, in particular, for the manufacture of a printed wiring board having a metal-plated through hole such as a double face printed wiring board and a multilayer printed wiring board. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
