发明名称 |
PRINTED CIRCUIT BOARD MINIMIZING UNDESIRABLE SIGNAL REFLECTIONS IN A VIA AND METHODS THEREFOR |
摘要 |
<p>What is provided is a multi-layer PCB having a plurality of stacked dielectric layers, a conductor disposed on at least one of the plurality of dielectric layers, and a non-conductive via extending through at least a portion of the plurality of dielectric layers to intersect the conductor. A conductive body in an activated state is introduced into the non-conductive via, and upon contacting the conductor, the activated state conductive body adheres to the conductor. The activated state conductive body is then effected to a deactivated state, wherein the conductive body is affixed to the conductor to provide an electrical connection thereto.</p> |
申请公布号 |
WO2004098253(A1) |
申请公布日期 |
2004.11.11 |
申请号 |
WO2004US12704 |
申请日期 |
2004.04.23 |
申请人 |
TERADYNE, INC. |
发明人 |
KHILCHENKO, LEON, M.;GAILUS, MARK, W. |
分类号 |
H05K1/00;H05K3/32;H05K3/34;H05K3/40;(IPC1-7):H05K3/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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