发明名称 METHOD FOR MANUFACTURING THICK-FILM MULTILAYER SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a thick-film multilayer substrate in which desirable effects such as reduction in the variation of a resistance value of thick-film resistance after laser trimming, the suppression of an increase in laser output, the securing of the degree of freedom of wiring laying, and the protection of the thick-film resistance. <P>SOLUTION: A part of a glass insulating layer 2 is formed on a thick-film resistance 6 on a ceramic substrate 1, and then laser trimming is performed through a window or the glass insulating layer 2, and then residual glass insulating layers 3, 4 are formed. Accordingly, the following effects are obtained: (1) Variation of a resistance value of the thick film resistance 6 is reduced after laser trimming. (2) Increase in laser output is suppressed. (3) Since the window is not opened in the residual glass insulating layers 3, 4 including at least the uppermost layer on the thick film resistance 6, a wiring pattern can be laid thereon to protect the thick film resistance 6. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004320052(A) 申请公布日期 2004.11.11
申请号 JP20040210975 申请日期 2004.07.20
申请人 DENSO CORP 发明人 OTANI YUJI;NAGASAKA TAKASHI;SAITO MITSUHIRO
分类号 H05K3/46;H01L23/12;(IPC1-7):H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址