| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a high heat dissipation type plastic package which has less bleeding of the resin of an adhesive, is inexpensive, has satisfactory bonding precision and has a thin thickness without using a thick adhesive such as a prepreg between a resin substrate and a heat dissipation plate, and to provide a manufacturing method thereof. SOLUTION: In the high heat dissipation type plastic package 10, a resin film 11 with Cu foil which is formed by joining an adhesive resin 13 on the Cu foil 23 and has a notch 15 formed by drilling, for a cavity 14 for placing a semiconductor element on a substantial center in a plan view and a heat dissipating plate 12 for dissipating heat from the semiconductor element are directly joined with the adhesive resin 13. The heat dissipating plate 12 has a blocking portion 20 for preventing the resin from bleeding at the time of joining the film 11 and the adhesive resin 13. COPYRIGHT: (C)2005,JPO&NCIPI |
