发明名称 CHIP TYPE FUSE
摘要 PROBLEM TO BE SOLVED: To provide a chip type fuse improved in a quick-fusing property of a fuse element in overcurrent application, and restrained in change of a characteristic of the fuse element in the manufacturing stage. SOLUTION: This chip type fuse is characteristically provided with: an insulating board; a base glass layer formed on the upper surface of the insulating board; the first fuse element formed on the upper surface of the base glass layer; front electrodes formed at both ends of the first fuse element; the second fuse element formed on the first fuse element and having a melting point lower than that of the first fuse element; and a protective layer formed of silicone rubber covering the second fuse element. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004319195(A) 申请公布日期 2004.11.11
申请号 JP20030109873 申请日期 2003.04.15
申请人 KOA CORP 发明人 ODA DAIZO;USUI HISASHI
分类号 H01H85/11;H01H85/0445;H01H85/143;(IPC1-7):H01H85/11;H01H85/044 主分类号 H01H85/11
代理机构 代理人
主权项
地址