HIGHLY ADAPTABLE HETEROGENEOUS POWER AMPLIFIER IC MICRO-SYSTEMS USING FLIP CHIP AND MICROELECTROMECHANICAL TECHNOLOGIES ON LOW LOSS SUBSTRATES

摘要

A first MEM (329) having first and second contact is mounted on a substrate. A PA power cell is thermally connected to the substrate using a thermal bump. The power cell has first and second power cell bumps as pathways for I/O functions. A first insulator (319) is mounted on substrate supporting a second MEM (327), having first and second connections, located on a bottom surface. This first conductive via (313) traverses the first insulator and connect the first connection from the second MEM to a first conductor connected to the first power cell bump . The second conductor (335) is connected to a second conductive via (307), which traverses a second insulator. The second conductive via is connected to a first metal member. The second conductive via is connected to a first metal member (305) formed over the upper surface of the second insulator and connected to a first input to the first MEM switch. A second metal member (303) is connected to the second contact of the first MEM switch.