| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a printing mask and a flip chip-type IC, by which the surface of a passivation layer can effectively be prevented from being damaged at the time of printing paste. <P>SOLUTION: In the printing mask 6 where a plurality of long openings 7 are formed, edges along the longitudinal direction of the openings 7 are inclined with respect to a direction orthogonal to the arranging direction of the openings 7. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
