| 摘要 |
PROBLEM TO BE SOLVED: To provide a film forming device capable of realizing the uniform rapid temperature increase of a substrate. SOLUTION: This film forming device is provided with an electrode 3 arranged in a vacuum container 1 so as to be relatively inclined to a vertical surface, an electrode 4 arranged so as to be faced to the electrode 3 for holding a substrate 5 in the vacuum container 1 and a heater 7 arranged at the back side of the electrode 4, and configured to heat the substrate 5 by the heater 7 through the electrode 4 functioning as a heater cover. In this case, a uniform heating plate 11 formed of aluminum constituted of materials whose heat conductivity is high is butted to the back face of the electrode 3 so that the heat distribution of the substrate 5 can be made uniform. COPYRIGHT: (C)2005,JPO&NCIPI
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