| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic electronic component that can suppress the peeling of second ceramic layers. SOLUTION: In this method, a laminate having the second ceramic layers 12 laminated upon the top and bottom surfaces of the laminate is manufactured by alternately laminating first ceramic layers 11 and internal electrodes 13 formed by using metallic paste containing a plasticizer upon another. Then the plasticizer is diffused into the second ceramic layers 12 by maintaining the laminate at a prescribed temperature. Thereafter, the laminate is baked by pressurizing and heating the laminate. Finally, external electrodes 14 are formed. COPYRIGHT: (C)2005,JPO&NCIPI
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