| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyether-based resin which has a high adhesiveness and further develops excellent characteristics in photosensitivity, heat resistance, low dielectric constant, low dielectric dissipation factor, and low hygroscopic property. SOLUTION: The polyether-based resin is characterized in that it is a copolymer having a repeating unit represented by general formula (I) (in the formula, x is a rational number within the range of 0<x≤100 and exhibits the copolymerization ratio in the resin, A is a 1-10C divalent alkylene group, -SO<SB>2</SB>-, -SO-, -S-, -O-, or -CO-, a and b are each independently an integer of 0-4, m is 0 or 1, n is an integer of 1-3, R<SB>1</SB>-R<SB>6</SB>are each independently either of hydrogen or a 1-8C alkyl group, wherein at least one of R<SB>1</SB>-R<SB>4</SB>is a group other than hydrogen, B is a divalent group of a heterocyclic compound having at least one or more heteroatoms in the ring). COPYRIGHT: (C)2005,JPO&NCIPI
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