| 摘要 |
A power monitoring arrangement for semiconductor light emitting devices used in optoelectronic packages includes a mounting structure, a light emitting device, and a monitor photodetector. The mounting structure has a mounting surface with the light emitting device and the monitor photodetector positioned thereon. The light emitting device provides emitted light at a monitoring output and an active output. The monitor photodetector has a light sensitive region and is positioned on the mounting surface of the mounting structure proximate the monitoring output of the light emitting device. A hemisphere of material is formed to include at least the light sensitive region of the monitor photodetector and the monitoring output of the light emitting device. An outer surface of the hemisphere operates as a reflecting surface to reflect light from the monitoring output of the light emitting device to the light sensitive region of the monitor photodetector.
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