Redistribution layer shielding of a circuit element

摘要

In some embodiments of the present invention, an apparatus includes an electromagnetic shielding structure. The electromagnetic shielding structure is formed at least partially in one or more redistribution layers formed on an integrated circuit die. The electromagnetic shielding structure substantially surrounds a circuit element, such as an inductor structure. The circuit element may be formed at least partially in the one or more redistribution layers. An inductor structure may be constructed as a loop structure at least partially in one or more redistribution layers formed on the integrated circuit die. The shielding structure may be formed at least partially in one or more redistribution layers of the integrated circuit die to enclose the inductor in a Faraday cage-like enclosure. The redistribution layers may be formed above integrated circuit pads or above a passivation layer of the integrated circuit die.