| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for working a semiconductor wafer which is reduced in the impure nature thereof and excellent in resistance to chipping while preventing the jump of chips upon dicing when the semiconductor wafer is worked. SOLUTION: The adhesive sheet for working a semiconductor wafer is constituted by a method wherein a base resin, a radiation polymerisable compound, a radiation polymerisable polymerization initiator, and an adhesive agent consisting of a crosslinking agent, are applied on the surface of a film substrate having permeability with respect to ultra-violet ray and/or electronic ray. The thickness of the adhesive agent is 1-10μm, and the adhesive agent is constituted of 100 wt.pt. of the base resin, 30-90 wt.pt. of the radiation polymerisable compound, 0.05-20 wt.pt. of the radioactive polymerisable polymerization initiator and 2-12 wt.pt. of the crosslinking agent. COPYRIGHT: (C)2005,JPO&NCIPI |
