| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of QFN package or SON package structure capable of further reducing the size and thickness of a semiconductor component inexpensively and suitable for mass production, and to provide its manufacturing process. SOLUTION: The resin sealed semiconductor device has an LOC structure where each terminal member 110 having a lead part rendered thin by half-etching is directed in the same direction, the surface and rear of an external terminal part and the terminal surface 112a of an internal terminal part 111 are rendered flush with each other, each terminal member is arranged at the peripheral part while directing the external terminal part 112 outward and directing the internal terminal part side inward and the lead part 114 of each terminal member is mounted on the periphery of the terminal surface 120a of a semiconductor element 120, or has a COL structure where the semiconductor element is mounted on the lead part of each terminal member on the periphery of rear surface which is not the terminal surface. One surface at the thick part of the external terminal part on the half-etched surface 114a side of each terminal member and the outer side face are exposed as the terminal surface and other parts are resin sealed. COPYRIGHT: (C)2005,JPO&NCIPI
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