发明名称 Semiconductor device and method of manufacturing the same
摘要 There are provided a gate electrode formed on a semiconductor substrate of one conductivity type via a gate insulating film, ion-implantation controlling films formed on both side surfaces of the gate electrode and having a space between the gate electrode and an upper surface of the semiconductor substrate, first and second impurity diffusion regions of opposite conductivity type formed in the semiconductor substrate on both sides of the gate electrode and serving as source/drain, a channel region of one conductivity type formed below the gate electrode between the first and second impurity diffusion regions of opposite conductivity type, and pocket regions of one conductivity type connected to end portions of the impurity diffusion regions of opposite conductivity type in the semiconductor substrate below the gate electrode and having an impurity concentration of one conductivity type higher than the channel region.
申请公布号 US2004224517(A1) 申请公布日期 2004.11.11
申请号 US20040866763 申请日期 2004.06.15
申请人 FUJITSU LIMITED 发明人 SUGIYAMA KOICHI;TAKAO YOSHIHIRO;SUGATANI SHINJI;MATSUNAGA DAISUKE;WADA TAKAYUKI;FUJITA TOHRU;KOKURA HIKARU
分类号 H01L29/41;H01L21/265;H01L21/336;H01L21/60;H01L21/8234;H01L21/8238;H01L27/092;H01L29/10;H01L29/78;(IPC1-7):H01L29/76;H01L29/94;H01L31/062;H01L31/113;H01L31/119;H01L21/302;H01L21/461 主分类号 H01L29/41
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