| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a compact semiconductor device having a compound function. <P>SOLUTION: In a semiconductor device where a semiconductor chip 30 is mounted in a cavity formed in a wiring board while being sealed with resin 16, outer surface of the wiring board 10 on the side where the cavity 12 is formed, including the region where the cavity 12 is formed, is entirely formed as a circuit region for forming a circuit pattern 18 or mounting a circuit component. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
