发明名称 HEAT STORAGE RESIN BOARD AND ITS UTILIZATION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin board having heat storage property usable as a building material maintaining a comfortable room temperature for a long time even with a large change in outside air temperature by the gradual radiation of heat stored beforehand by an air-conditioning and heating apparatus or natural energy by arranging the resin board on the indoor side surface of the wall, ceiling or floor of a house, or as a core material of a rush mat or a heat storage material for heating the floor. <P>SOLUTION: The heat storage resin board is obtained by the thermocompression bonding and molding of a composition comprising microcapsules containing a heat storage material, a synthetic resin cut material and an adhesive. As the size of the synthetic resin cut material, it is preferable that the minor axis is in a range of 0.1-10 mm and that the major axis is in a range of 1-50 mm. It is also preferable that at least one face of the board is covered with a noncombustible or gas impermeable sheet. An interior material for building is formed using the microcapsules containing the heat storage material with the fusing point in a range of 5-40&deg;C, and the heat storage material for heating the floor is formed using the heat storage material with the fusing point in a range of 20-60&deg;C. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004316245(A) 申请公布日期 2004.11.11
申请号 JP20030111576 申请日期 2003.04.16
申请人 MITSUBISHI PAPER MILLS LTD 发明人 ISHIGURO MAMORU
分类号 E04B1/80;C09K5/06;F24D11/00;F28D20/02 主分类号 E04B1/80
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