| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition having excellent heat resistance and moisture resistance reliability of a hardened product and having high photosensitivity. <P>SOLUTION: The alkali developing type photosensitive resin composition contains: (A) a photopolymerizable unsaturated compound containing a carboxyl group; (B) an epoxy resin; and (C) a photopolymerization initiator. The epoxy resin (B) is obtained by allowing an adduct of an alicyclic or aromatic compound (b1) having two double bonds in one molecule and a hydroxyl group-containing aromatic compound (b2) to react with an epihalohydrin. The maximum absorbance of the epoxy resin (B) in a 1 wt.% solution of 1,4-dioxane measured by a UV and visible ray spectrophotometer is ≤0.250 in the 350 to 360 nm range and ≤0.100 in the 400 to 410 nm range. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
