| 摘要 |
PROBLEM TO BE SOLVED: To provide a system and a method for soldering an electronic part to a flexible substrate sensitive to heat by the cooling of the vector transient reflow process. SOLUTION: The method for soldering an electronic part sensitive to heat by the cooling of the vector transient reflow process is disclosed. The method comprises the steps of attaching a solder paste to the substrate; placing an electronic part on the substrate and forming a substrate assembly; and arranging the substrate assembly on a pallet, equipped with a thermally conductive material for a heat sink means for the substrate. The method further comprises the steps of rapidly heating the attached solder paste locally and heating the solder paste to a melting point at which the solder paste is melted, using an additional heat source; and forming a temperature gradient across the substrate by cooling a second surface of the pallet and dissipating heat from the substrate, while further rapidly locally heating the attached paste. COPYRIGHT: (C)2005,JPO&NCIPI
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