SOLDERED CONNECTION, METHOD FOR SOLDERING, AND APPARATUS FOR MANUFACTURING ELECTRONIC COMPONENT BY USING THEM

摘要

PROBLEM TO BE SOLVED: To provide a soldered connection using a zinc-based lead-free solder high in bonding strength, to provide a method for performing the soldering, and to provide an apparatus for manufacturing electronic components by using them. SOLUTION: A first alloy layer 30 mainly comprising a tin-copper alloy and tin is formed on a soldering pad 2, and the first alloy layer 30 is positioned between a zinc-based lead-free solder layer 33 and the soldering pad 2. In this way, a soldered connection using a zinc-based lead-free solder high in bonding strength is realized. COPYRIGHT: (C)2005,JPO&NCIPI