| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which can give a cured product good in all of properties such as high permittivity, low dielectric loss tangent, mechanical strengths, impact resistance, and thermal shock resistance and to provide an electronic component material using the same. SOLUTION: The resin composition comprises a siloxane-modified polyamide-imide resin containing siloxane units represented by formula (A) and has a relative permittivity of at least 15 at 25°C as measured on a cured product thereof. In formula (A), R<SB>4</SB>and R<SB>5</SB>are each a divalent organic group; R<SB>6</SB>to R<SB>11</SB>are each independently one member selected from an alkyl group, a phenyl group, and a substituted phenyl group; a monomer unit containing R<SB>6</SB>and R<SB>10</SB>is not identical with a monomer unit containing R<SB>8</SB>and R<SB>11</SB>, p is an integer of 1 to 50, and q is an integer of 1 to 50. COPYRIGHT: (C)2005,JPO&NCIPI |
