发明名称 |
Multi-chip package with electrical interconnection |
摘要 |
A multi-chip package with electrical interconnection comprises a leadframe, at least a relay conductor, at least a first chip, at least a second chip, a plurality of bonding wires and a molding compound. A dielectric carrier is attached to the leadframe for fixing the relay conductor. The relay conductor has a top surface for interconnection of the bonding wires and a bottom surface attached to the dielectric carrier to electrically isolated from the leadframe. The bonding wires electrically connect the bonding pads of the first chip and second chip to the common lead of the leadframe through the relay conductor so as to achieve electrical interconnection of the plurality of chips and the leadframe inside the molding compound with lower cost.
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申请公布号 |
US2004222503(A1) |
申请公布日期 |
2004.11.11 |
申请号 |
US20040838351 |
申请日期 |
2004.05.05 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING INC. |
发明人 |
LEE BAU-NAN;CHEN CHENG-FEN;TSAI CHIH-WEI;HUNG CHIH-PIN |
分类号 |
H01L21/56;H01L21/68;H01L23/31;H01L23/495;(IPC1-7):H01L23/495;H01L23/02 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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