发明名称 |
Methods and apparatus for attaching MEMS devices to housing |
摘要 |
A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method comprises depositing a plurality of clusters of contact material onto a bottom surface of the housing, placing the die onto the clusters, and subjecting the housing, the clustered contacts, and the die to a thermocompression bonding process.
|
申请公布号 |
US2004223373(A1) |
申请公布日期 |
2004.11.11 |
申请号 |
US20030431420 |
申请日期 |
2003.05.07 |
申请人 |
DCAMP JON B.;CURTIS HARLAN L.;DUNAWAY LORI A.;GLENN MAX C. |
发明人 |
DCAMP JON B.;CURTIS HARLAN L.;DUNAWAY LORI A.;GLENN MAX C. |
分类号 |
B81B7/00;G01C19/56;H01L21/60;H01L21/603;(IPC1-7):G11C11/34 |
主分类号 |
B81B7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|