| 发明名称 |
Polishing pad and chemical mechanical polishing method |
| 摘要 |
A polishing pad for chemical mechanical polishing, which has an excellent removal rate and is capable of polishing for providing excellent planarity. This polishing pad comprises 70 to 99.9 mass % of (A) a crosslinked diene elastomer and 0.1 to 30 mass % of (B) a polymer having an acid anhydride structure based on 100 mass % of the total of the above components (A) and (B) and has a specific gravity of 0.9 to 1.2. |
| 申请公布号 |
US2004224616(A1) |
申请公布日期 |
2004.11.11 |
| 申请号 |
US20040829936 |
申请日期 |
2004.04.23 |
| 申请人 |
JSR CORPORATION |
发明人 |
SHIHO HIROSHI;OKAMOTO TAKAHIRO;HASEGAWA KOU;KAWAHASHI NOBUO |
| 分类号 |
B24B37/00;B24B37/04;B24B37/20;B24B37/22;B24B37/24;B24B37/26;B24D3/26;B24D13/14;C08J5/14;H01L21/304;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
