| 摘要 |
A semiconductor module of the type having a number of semiconductor chips disposed on a chip carrier has at least a second subset of the semiconductor chips disposed above a first subset and conductive connections between the semiconductor chips disposed one above another. The improvement includes flexible tapes forming conductive connections between the first subset of semiconductor chips and the second subset of semiconductor chips. Two of the flexible tapes originate from the first subset and lead to the second subset. The two flexible tapes respectively extend from a contact-making side of the first subset around respectively mutually opposite side faces of the first subset to the second subset. |
