| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique by which the output characteristics of a semiconductor device can be improved. <P>SOLUTION: The switching element of a power supply control circuit 13 formed on the semiconductor chip Csw for supplying power to the RF power module PM of a digital cellular phone. The emitter electrode of the semiconductor chip Csw is connected to the electrode CE2 in the main surface of the module substrate MCB. The electrode CE2 is electrically connected to the inner wiring CL1 of the module substrate MCB through a via hole VH2. Further, the wiring CL1 is electrically connected to an electrode CE3 on the back of the module substrate MCB through a via hole VH3 for supplying power. The semiconductor device is provided with a first semiconductor chip on which a transistor for the switching element of the power supply control circuit is formed, a second semiconductor chip on which an amplifier circuit which uses the power supply voltage from the power supply control circuit as a power source, and a wiring board on the main surface of which the first and second semiconductor chips are mounted. In addition, a connection extended in a direction intersecting the main rear surface of a wiring board is provided on the wiring route of the wiring board which connects the power supply electrode of the first semiconductor chip, and a power supply electrode provided on the rear surface of the wiring board to each other. A plurality of connections are joined to the power supply electrode of the first semiconductor chip and the power supply electrode on the rear surface of the wiring board. Consequently, the output characteristics of the semiconductor device can be improved. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
