发明名称 |
TWO-LAYER FLEXIBLE COPPER CLAD LAMINATE, AND METHOD OF PRODUCING THE TWO-LAYER FLEXIBLE COPPER CLAD LAMINATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a two-layer flexible copper clad laminate which is obtained by using a direct metallization method, and in which repellents such as Cr are not comprised in a seed layer. SOLUTION: The one side two-layer flexible copper clad laminate is obtained by a direct metallization method where a seed layer is formed on one side of a polyimide resin film base material, and a copper layer is formed on the seed layer. In the seed layer, each film and layer of: (a) a nickel based thin film with a mean thickness of 50 to 700 nm; (b) an amorphous cobalt film with a mean thickness of 10 to 80 nm made amorphous; and (c) a mixed layer with a mean thickness of 50 to 180 nm in which cobalt particles and/or cobalt oxide particles and a polyimide resin are coexist lie in a laminated state. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2004315945(A) |
申请公布日期 |
2004.11.11 |
申请号 |
JP20030114953 |
申请日期 |
2003.04.18 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
YOKOTA TOSHIKO;TAKAHASHI SUSUMU;MATSUSHIMA HIDEAKI;DOBASHI MAKOTO;ISHII MASATO |
分类号 |
H05K1/09;B32B15/08;B32B15/088;C23C18/16;C23C18/20;C23C18/34;C23C18/52;C25D5/56;C25D7/00;H05K3/38;(IPC1-7):C23C18/20 |
主分类号 |
H05K1/09 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|