发明名称 TWO-LAYER FLEXIBLE COPPER CLAD LAMINATE, AND METHOD OF PRODUCING THE TWO-LAYER FLEXIBLE COPPER CLAD LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a two-layer flexible copper clad laminate which is obtained by using a direct metallization method, and in which repellents such as Cr are not comprised in a seed layer. SOLUTION: The one side two-layer flexible copper clad laminate is obtained by a direct metallization method where a seed layer is formed on one side of a polyimide resin film base material, and a copper layer is formed on the seed layer. In the seed layer, each film and layer of: (a) a nickel based thin film with a mean thickness of 50 to 700 nm; (b) an amorphous cobalt film with a mean thickness of 10 to 80 nm made amorphous; and (c) a mixed layer with a mean thickness of 50 to 180 nm in which cobalt particles and/or cobalt oxide particles and a polyimide resin are coexist lie in a laminated state. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004315945(A) 申请公布日期 2004.11.11
申请号 JP20030114953 申请日期 2003.04.18
申请人 MITSUI MINING & SMELTING CO LTD 发明人 YOKOTA TOSHIKO;TAKAHASHI SUSUMU;MATSUSHIMA HIDEAKI;DOBASHI MAKOTO;ISHII MASATO
分类号 H05K1/09;B32B15/08;B32B15/088;C23C18/16;C23C18/20;C23C18/34;C23C18/52;C25D5/56;C25D7/00;H05K3/38;(IPC1-7):C23C18/20 主分类号 H05K1/09
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