发明名称 |
Metal polishing |
摘要 |
The present invention provides a process and liquid composition for selectively removing a metal film from a patterned substrate. The process, which is useful in the manufacture of semiconductor devices and circuits, comprises chemically reacting the metal film with a liquid and then removing the reaction product from the metal surfaces using a polishing pad. The present invention further provides a process to polish a metal surface in separate stages and at different rates by changing the chemical composition of the liquid.
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申请公布号 |
US2004224511(A1) |
申请公布日期 |
2004.11.11 |
申请号 |
US20040487484 |
申请日期 |
2004.02.23 |
申请人 |
PILLION JOHN E.;SHYU JIEH-HWA;BELONGIA BRETT |
发明人 |
PILLION JOHN E.;SHYU JIEH-HWA;BELONGIA BRETT |
分类号 |
B24B37/04;B24B37/20;B24B37/22;B24B37/24;B24D11/00;C23F3/00;H01L21/321;H01L21/3213;(IPC1-7):H01L21/302 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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