| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the generation of the flapping of the outer peripheral portion of a semiconductor wafer when grinding it, even though it is so ground extremely thinly that its thickness becomes not larger than 100 μm or 50 μm, in the case of so sucking it supportingly in a chuck table as to grind it, to prevent the sticking of ground chips on a semiconductor wafer. <P>SOLUTION: The chuck table 10 is mounted on a grinding apparatus for grinding a semiconductor wafer W while feeding grinding water to the wafer W, wherein it is constituted of a suction portion 11 for sucking the semiconductor wafer W and a frame 12 surrounding the suction portion 11, and the outer diameter of the suction portion 11 is made equal to or larger than the outer diameter of the sucked semiconductor wafer W, and further, a barrier plate 13 whose outer diameter is made smaller than the outer diameter of the semiconductor wafer W is so formed in the suction portion 11 as to partition thereby the suction portion 11 into an inner-periphery-side suction portion 14 and an outer-periphery-side suction portion 15. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
