| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a flexible multilayer circuit substrate with a fine conductive circuit effectively at a low cost, and the formed multilayer circuit substrate. SOLUTION: The method for manufacturing the circuit substrate formed of an insulating resin with a via hole comprises a process for forming a circuit part in a substrate surface by attaching a conductive paste to the surface of a substrate which is formed by forming a conductive paste applied part and a conductive paste repelling part in a surface, a process for laminating an insulating resin layer and a resin film on a circuit part formation surface, a process for forming a boring part in a desired position of the insulating resin layer and the resin film, a process for putting a via hole conductive paste in the boring part and hardening it and a process for removing the resin film and the substrate. Thereby, it is possible to form a multilayer circuit substrate with a fine conductor circuit readily. COPYRIGHT: (C)2005,JPO&NCIPI |
