| 摘要 |
PROBLEM TO BE SOLVED: To provide a light receiving module wherein reflectivity is small, and improvement of photoelectric conversion efficiency in the case of communication and reduction of reflective return light turning to noise to a partner element are enabled. SOLUTION: In the light receiving module, a photodiode 1 and an integrated circuit 3 for signal conversion are mounted in different regions of an upper surface 4A of a substrate 4. The upper surface 1A of the photodiode 1 protrudes from the upper surface 3A of the integrated circuit 3 in the normal direction of the upper surface 4A of the substrate 4. As a result, when resin sealing of the integrated circuit 3 is performed by a potting method, resin which is dropped on the upper surface 3A of the integrated circuit 3 and flows is dammed up with step-difference between the upper surface 3A of the integrated circuit 3 and the upper surface 1A of the photodiode 1. Consequently, protective resin member 6 composed of the sealing resin for sealing the integrated circuit 3 can be prevented from getting to the upper surface 1A of the photodiode 1. COPYRIGHT: (C)2005,JPO&NCIPI |
