摘要 |
PROBLEM TO BE SOLVED: To provide a method for readily unsealing semiconductor integration equipment at a low cost without corroding the inside of the equipment, without using an organic solvent, and without deteriorating electric characteristics. SOLUTION: A sealing resin of an integrated circuit covered with a film layer member is removed by a first step of cutting by means of a metal file or the like, a second step of cutting by means of laser irradiation, and a third step of cutting by means of compressed gas. COPYRIGHT: (C)2005,JPO&NCIPI
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