发明名称 METHOD FOR UNSEALING SEALED RESIN OF SEMICONDUCTOR INTEGRATION EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a method for readily unsealing semiconductor integration equipment at a low cost without corroding the inside of the equipment, without using an organic solvent, and without deteriorating electric characteristics. SOLUTION: A sealing resin of an integrated circuit covered with a film layer member is removed by a first step of cutting by means of a metal file or the like, a second step of cutting by means of laser irradiation, and a third step of cutting by means of compressed gas. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004319752(A) 申请公布日期 2004.11.11
申请号 JP20030111547 申请日期 2003.04.16
申请人 CANON INC 发明人 ICHIHASHI KENJI
分类号 H01L21/56;(IPC1-7):H01L21/56 主分类号 H01L21/56
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