| 摘要 |
PROBLEM TO BE SOLVED: To provide a shield cap type electronic device suitable for mass production with the shielding effect increased. SOLUTION: The shield cap type electronic device 11 is such that it has a multilayer base substrate 12 sealed airtight by a shield cap 3. On the upper surface of the base substrate 12, an upper surface printed circuit pattern 13 for constituting an electronic circuit is formed, whereto circuit-constituting elements are bonded immovable with solder or the like. The printed circuit pattern 13 that is led out to an external connection terminal 15 via a side face terminal 14 is formed in the first intermediate layer of the base substrate 12. On the upper surface of the base substrate 12, a grounded annular electrode pattern is formed, whereto the periphery of the opening of the shield cap 3 is bonded immovable. The upper surface of the annular electrode pattern is applied with a conductive adhesive 16, whereon the metal-made shield cap 3 is bonded immovable and is grounded. COPYRIGHT: (C)2005,JPO&NCIPI
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