EQUIPMENT AND METHOD FOR SUBSTRATE PROCESSING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce dopant stuck on a surface of a wafer in a process wherein cleaning of atmosphere in the treatment space of a wafer is necessary. SOLUTION: Substrate processing equipment is provided wherein treatment is performed to a wafer W in the state that plates 16 for dopant trapping coated with gas for treating the wafer W are arranged almost in parallel to the wafer W at the periphery of the wafer W, in substrate processing equipment wherein the wafer W is treated while making gas for treatment flow almost in parallel to the wafer W to the surface of the wafer W in a treatment room 1. COPYRIGHT: (C)2005,JPO&NCIPI