SUBSTRATE TREATING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a substrate treating device that can accurately treat substrates by quickly transporting the substrates. SOLUTION: This substrate treating device is provided with a heat-treating section 16 equipped with a hot plate 17 which heats the substrates W and a cooling plate 18 which cools the substrates W, a liquid-chemical treating section which treats the substrates W with a liquid chemical, and a first transporting mechanism which transports the substrates W between the heat-treating section 16 and liquid-chemical treating section. This device is also provided with a second transporting mechanism 12 which transports the substrates W between the hot plate 17 and the cooling plate 18. The second transporting mechanism 16 receives and delivers the substrates W from and to the substrate transporting arm 5a of the first transporting mechanism at a receiving and delivering position E provided at a position other than the position above the hot plate 17 or cooling plate 18. COPYRIGHT: (C)2005,JPO&NCIPI