发明名称 COPPER POWDER, MANUFACTURING METHOD THEREFOR, COPPER PASTE USING THE COPPER POWDER, COPPER PAINT AND ELECTRODE
摘要 PROBLEM TO BE SOLVED: To provide a copper powder used for an electrode in a capacitor or the like, which has improved oxidation resistance. SOLUTION: This copper powder has the surface of a copper particle modified with 0.1-20 wt.% sulfur compounds such as mercaptopropionate, dodecanthiol, hexanethiol, methyl thioglycolate, ethyl thioglycolate and cysteine. The method for producing such a copper powder comprises, for instance, reacting a copper compound with a reducing agent in a medium to obtain copper particles, and subsequently contacting the obtained copper particles with a sulfur compound to modify the surface of the copper particles with the sulfur compound. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004315853(A) 申请公布日期 2004.11.11
申请号 JP20030108106 申请日期 2003.04.11
申请人 ISHIHARA SANGYO KAISHA LTD 发明人 TOMONARI MASANORI
分类号 B22F9/20;B22F1/00;B22F1/02;C23C22/52;H01B1/00;H01B1/22;H01B13/00;H01G4/008;(IPC1-7):B22F1/02 主分类号 B22F9/20
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