发明名称 Enhanced compliant probe card systems having improved planarity
摘要 Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Alternate card assembly structures comprise a stiffening structure and a compliant carrier structure, such as a decal or screen, which is fixedly attached to the probe chip substrate.
申请公布号 US2004223309(A1) 申请公布日期 2004.11.11
申请号 US20040870095 申请日期 2004.06.16
申请人 HAEMER JOSEPH MICHAEL;CHONG FU CHIUNG;MODLIN DOUGLAS N. 发明人 HAEMER JOSEPH MICHAEL;CHONG FU CHIUNG;MODLIN DOUGLAS N.
分类号 G01R1/067;G01R1/073;G01R3/00;G01R31/28;H05K3/40;H05K7/10;(IPC1-7):H05K7/06 主分类号 G01R1/067
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