Rectifier chip terminal has chip fixed by solder point, packaging encapsulation filling; terminal is plugged into bore connecting journals on circuit substrate and chip is sealed with packaging glass

摘要

The rectifier chip terminal has a chip (32) fixed in the terminal by a solder point and a packaging encapsulation filling (34), whereby the terminal is plugged into bore connecting journals on the circuit substrate and the rectifier chip is sealed with a packaging glass (33). A free space is formed to ensure that the packaging glass does not crack through thermal expansion.