| 摘要 |
<p>An epoxy resin composition for semiconductor encapsulation is disclosed which essentially contains an epoxy resin, a phenol resin, an inorganic filler, a curing accelerator, and a carbon precursor having an electric specific resistance within the semiconductor range that is not less than 1 x 10<2> ohm.cm but less than 1 x 10<7> ohm.cm. The inorganic filler is contained in an amount of 65-92% by weight and the carbon precursor is contained in an amount of 0.1-5.0% by weight, to the total epoxy resin composition. By using such an epoxy resin composition, an excellent YAG laser markability can be attained while preventing electric defects such as short-circuit of wiring and leakage current generation and metal wiring deformation.</p> |
