发明名称 ROOM TEMPERATURE SHRINKING RUBBER UNIT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a room temperature shrinking rubber unit short in manufacturing and delivery time, at a low in manufacturing cost and having good quality by forming an outer semiconductor layer easily and shortening the time required for formation and making the thickness be hardly varied. <P>SOLUTION: The room temperature shrinking rubber unit is provided with an inner semiconductor layer 1 formed principally of rubber material such as ethylene propylene rubber (EPR), silicon rubber (SR), a reinforcing insulation layer 3, an outer semiconductor layer 11, stress cone parts 7 and 7 on the opposite end sides of the reinforcing insulation layer 3, and parts 9 and 9 provided in the vicinity of both stress cone parts 7 and 7 of the outer semiconductor layer 11 in order to separate the outer semiconductor layer 11 in the longitudinal direction. The inner semiconductor layer 1, the reinforcing insulation layer 3, the outer semiconductor layer 11 and the stress cone parts 7 and 7 are molded into a substantially tubular one piece. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004320960(A) 申请公布日期 2004.11.11
申请号 JP20030114751 申请日期 2003.04.18
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 KOBAYASHI SHOZO;TAKAOKA ISAO
分类号 H02G1/14;B32B1/08;B32B3/02;B32B7/02;H02G15/08;H02G15/18;H02G15/184;(IPC1-7):H02G15/08 主分类号 H02G1/14
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