| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly-accurate and highly-reliable pressure sensor having higher added-value than hitherto by suppressing or removing the changes over aging or humidity dependency to the utmost. SOLUTION: Splitting grooves (S1a, S1b, S2a, S2b) of a wafer 800 are formed by half cut processing for stopping removing just before a removing portion by dicing, scribing, etching, laser irradiation or the like reaches a deformable space between positive and negative both electrodes. For example, when forming the splitting grooves for splitting the wafer 800 into pressure detection chip units in this way, the deformable space is adjusted so as not to be in direct contact with the external environment of the wafer, and thereby positive ions such as sodium ions deposited following anode joint are prevented from entering the deformable space. Consequently, undesirable phenomenons as the pressure sensor such as the humidity dependency can be suppressed effectively, and thereby this pressure sensor having a high added-value can be manufactured. COPYRIGHT: (C)2005,JPO&NCIPI
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