| 摘要 |
A heat emitting body (3) is provided in between the substrates (1) in a position upstream from the point where the two substrates come into contact with each other. A continuous method for bonding two or more substrates, the surface of at least one substrate being provided with a binder, comprises the following steps: (A) placing a heat emitting body in between the substrates in a position upstream from the point where the two substrates come into contact with each other, the body being close enough to maintain the substrate surfaces at the temperature required for bonding; (B) pressing the substrates together, preferably using a double belt press; and (C) cooling. |
