| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which reliability is enhanced for temperature variation. SOLUTION: The semiconductor device 10A comprises a semiconductor element 11, a flexible sheet 14 mounting the semiconductor element 11, and sealing resin 12 covering the semiconductor element 11 with the surface abutting against the flexible sheet wherein the forward end part of the flexible sheet 14 extends to the rear surface of the sealing resin 12 and an external electrode 15 is formed at the forward end part. Consequently, the external electrode is protected against damage due to thermal stress being generated when the semiconductor element is used. Since the forward end part of the flexible sheet and the rear surface of sealing resin are bonded through thermoplastic adhesive resin, thermal stress is buffered by the adhesive resin thus enhancing reliability of the semiconductor device. COPYRIGHT: (C)2005,JPO&NCIPI
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